- •Foreword
- •Preface
- •Contents
- •Symbols
- •1 Electromagnetic Field and Wave
- •1.1 The Physical Meaning of Maxwell’s Equations
- •1.1.1 Basic Source Variables
- •1.1.2 Basic Field Variables
- •1.1.3 Maxwell’s Equations in Free Space
- •1.1.4 Physical Meaning of Maxwell’s Equations
- •1.1.5 The Overall Physical Meaning of Maxwell’s Equations
- •1.2 Electromagnetic Power Flux
- •1.2.1 The Transmission of Electromagnetic Power Flux
- •1.2.2 Capacitors—Electrical Energy Storage
- •1.2.3 Inductor—Magnetic Energy Storage
- •1.2.4 Examples of Device Properties Analysis
- •1.3.1 Boundary Conditions of the Electromagnetic Field on the Ideal Conductor Surface
- •1.3.2 Air Electric Wall
- •2 Microwave Technology
- •2.1 The Theory of Microwave Transmission Line
- •2.1.1 Overview of Microwave Transmission Line
- •2.1.2 Transmission State and Cutoff State in the Microwave Transmission Line
- •2.1.3 The Concept of TEM Mode, TE Mode, and TM Mode in Microwave Transmission Line
- •2.1.4 Main Characteristics of the Coaxial Line [4]
- •2.1.5 Main Characteristics of the Waveguide Transmission Line
- •2.1.6 The Distributed Parameter Effect of Microwave Transmission Line
- •2.2 Application of Transmission Line Theories in EMC Research
- •3 Antenna Theory and Engineering
- •3.1 Field of Alternating Electric Dipole
- •3.1.1 Near Field
- •3.1.2 Far Field
- •3.2 Basic Antenna Concepts
- •3.2.1 Directivity Function and Pattern
- •3.2.2 Radiation Power
- •3.2.3 Radiation Resistance
- •3.2.4 Antenna Beamwidth and Gain
- •3.2.6 Antenna Feed System
- •4.1.1 Electromagnetic Interference
- •4.1.2 Electromagnetic Compatibility
- •4.1.3 Electromagnetic Vulnerability
- •4.1.4 Electromagnetic Environment
- •4.1.5 Electromagnetic Environment Effect
- •4.1.6 Electromagnetic Environment Adaptability
- •4.1.7 Spectrum Management
- •4.1.9 Spectrum Supportability
- •4.2 Essences of Quantitative EMC Design
- •4.2.2 Three Stages of EMC Technology Development
- •4.2.3 System-Level EMC
- •4.2.4 Characteristics of System-Level EMC
- •4.2.5 Interpretations of the EMI in Different Fields
- •4.3 Basic Concept of EMC Quantitative Design
- •4.3.1 Interference Correlation Relationship
- •4.3.2 Interference Correlation Matrix
- •4.3.3 System-Level EMC Requirements and Indicators
- •4.3.5 Equipment Isolation
- •4.3.6 Quantitative Allocation of Indicators
- •4.3.7 The Construction of EMC Behavioral Model
- •4.3.8 The Behavior Simulation of EMC
- •4.3.9 Quantitative Modeling Based on EMC Gray System Theory
- •5.2 Solution Method for EMC Condition
- •5.3 EMC Modeling Methodology
- •5.3.1 Methodology of System-Level Modeling
- •5.3.2 Methodology for Behavioral Modeling
- •5.3.3 EMC Modeling Method Based on Gray System Theory
- •5.4 EMC Simulation Method
- •6.1 EMC Geometric Modeling Method for Aircraft Platform
- •6.2.1 Interference Pair Determination and Interference Calculation
- •6.2.2 Field–Circuit Collaborative Evaluation Technique
- •6.2.3 The Method of EMC Coordination Evaluation
- •6.3 Method for System-Level EMC Quantitative Design
- •6.3.2 The Optimization Method of Single EMC Indicator
- •6.3.3 The Collaborative Optimization Method for Multiple EMC Indicators
- •7.1 The Basis for EMC Evaluation
- •7.2 The Scope of EMC Evaluation
- •7.2.1 EMC Design
- •7.2.2 EMC Management
- •7.2.3 EMC Test
- •7.3 Evaluation Method
- •7.3.1 The Hierarchical Evaluation Method
- •7.3.2 Evaluation Method by Phase
- •8 EMC Engineering Case Analysis
- •8.1 Hazard of Failure in CE102, RE102, and RS103 Test Items
- •8.2 The Main Reasons for CE102, RE102, and RS103 Test Failures
- •8.2.1 CE102 Test
- •8.2.2 RE102 Test
- •8.2.3 RS103 Test
- •8.3 The Solutions to Pass CE102, RE102, and RS103 Tests
- •8.3.1 The EMC Failure Location
- •8.3.2 Trouble Shooting Suggestions
- •A.1 Pre-processing Function
- •A.2 Post-processing Function
- •A.3 Program Management
- •A.4 EMC Evaluation
- •A.5 System-Level EMC Design
- •A.6 Database Management
- •References
8.2 The Main Reasons for CE102, RE102, and RS103 Test Failures |
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Round hole
Fan power cable
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Case |
Fig. 8.6 Fan power cable and structure of the case |
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Sensor |
Signal |
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Display Terminal |
Sensor |
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Sensor |
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Signal |
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Processing |
Sensor |
Module |
Fig. 8.7 Composition of the sensor equipment |
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If the shielding of the case is continuous, i.e., there is no opening in the conductive case, then the shielding of the case shall be very effective in theory. However, any opening such as wires and holes can greatly reduce the shielding effectiveness.
8.2.3 RS103 Test
Example 8.4 In the RS103 test of certain sensor-type equipment, the 200 MHz–1 GHz susceptibility test was failed. And the higher the frequency, the more susceptive the equipment. The equipment was used to measure the change of a physical variable through a sensor. The change was then converted into an electrical signal and transmitted to the processor, as shown in Fig. 8.7.
In order to find the susceptive object and the coupling path, the copper mesh was used to cover the display module, the processing module, the interconnection cable, and the sensor of the product one by one, and the RS103 test was then performed. The test results showed that when the copper mesh covered the sensor and the transmission cable, the anti-interference ability of the equipment was improved. Therefore, it could
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8 EMC Engineering Case Analysis |
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(a) |
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Strength of field (V/m) |
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Frequency (MHz) |
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(b) |
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Strength of field (V/m) |
Frequency (MHz)
Fig. 8.8 Product susceptibility curve—a RS103 susceptibility curve, b RS103 susceptibility curve when the sensors and cables were covered by the copper mesh
be preliminarily determined that the sensor of the product, the transmission cable, and the connection portion between the two were the main paths for picking up electromagnetic energy, thereby causing the RS103 to fail. Figure 8.8a, b shows the RS103 susceptibility curves for the equipment before and after using the copper mesh. It can be seen from the susceptibility curve that due to the small size of the sensor, the coupling effect on the high-frequency electromagnetic field is strong, and as the frequency increases, the anti-interference ability of the product increases. The electric field intensity that causes susceptibility increases from a minimum of 15 V/m before the copper mesh covering to 64 V/m after the covering.