- •Preface
- •Imaging Microscopic Features
- •Measuring the Crystal Structure
- •References
- •Contents
- •1.4 Simulating the Effects of Elastic Scattering: Monte Carlo Calculations
- •What Are the Main Features of the Beam Electron Interaction Volume?
- •How Does the Interaction Volume Change with Composition?
- •How Does the Interaction Volume Change with Incident Beam Energy?
- •How Does the Interaction Volume Change with Specimen Tilt?
- •1.5 A Range Equation To Estimate the Size of the Interaction Volume
- •References
- •2: Backscattered Electrons
- •2.1 Origin
- •2.2.1 BSE Response to Specimen Composition (η vs. Atomic Number, Z)
- •SEM Image Contrast with BSE: “Atomic Number Contrast”
- •SEM Image Contrast: “BSE Topographic Contrast—Number Effects”
- •2.2.3 Angular Distribution of Backscattering
- •Beam Incident at an Acute Angle to the Specimen Surface (Specimen Tilt > 0°)
- •SEM Image Contrast: “BSE Topographic Contrast—Trajectory Effects”
- •2.2.4 Spatial Distribution of Backscattering
- •Depth Distribution of Backscattering
- •Radial Distribution of Backscattered Electrons
- •2.3 Summary
- •References
- •3: Secondary Electrons
- •3.1 Origin
- •3.2 Energy Distribution
- •3.3 Escape Depth of Secondary Electrons
- •3.8 Spatial Characteristics of Secondary Electrons
- •References
- •4: X-Rays
- •4.1 Overview
- •4.2 Characteristic X-Rays
- •4.2.1 Origin
- •4.2.2 Fluorescence Yield
- •4.2.3 X-Ray Families
- •4.2.4 X-Ray Nomenclature
- •4.2.6 Characteristic X-Ray Intensity
- •Isolated Atoms
- •X-Ray Production in Thin Foils
- •X-Ray Intensity Emitted from Thick, Solid Specimens
- •4.3 X-Ray Continuum (bremsstrahlung)
- •4.3.1 X-Ray Continuum Intensity
- •4.3.3 Range of X-ray Production
- •4.4 X-Ray Absorption
- •4.5 X-Ray Fluorescence
- •References
- •5.1 Electron Beam Parameters
- •5.2 Electron Optical Parameters
- •5.2.1 Beam Energy
- •Landing Energy
- •5.2.2 Beam Diameter
- •5.2.3 Beam Current
- •5.2.4 Beam Current Density
- •5.2.5 Beam Convergence Angle, α
- •5.2.6 Beam Solid Angle
- •5.2.7 Electron Optical Brightness, β
- •Brightness Equation
- •5.2.8 Focus
- •Astigmatism
- •5.3 SEM Imaging Modes
- •5.3.1 High Depth-of-Field Mode
- •5.3.2 High-Current Mode
- •5.3.3 Resolution Mode
- •5.3.4 Low-Voltage Mode
- •5.4 Electron Detectors
- •5.4.1 Important Properties of BSE and SE for Detector Design and Operation
- •Abundance
- •Angular Distribution
- •Kinetic Energy Response
- •5.4.2 Detector Characteristics
- •Angular Measures for Electron Detectors
- •Elevation (Take-Off) Angle, ψ, and Azimuthal Angle, ζ
- •Solid Angle, Ω
- •Energy Response
- •Bandwidth
- •5.4.3 Common Types of Electron Detectors
- •Backscattered Electrons
- •Passive Detectors
- •Scintillation Detectors
- •Semiconductor BSE Detectors
- •5.4.4 Secondary Electron Detectors
- •Everhart–Thornley Detector
- •Through-the-Lens (TTL) Electron Detectors
- •TTL SE Detector
- •TTL BSE Detector
- •Measuring the DQE: BSE Semiconductor Detector
- •References
- •6: Image Formation
- •6.1 Image Construction by Scanning Action
- •6.2 Magnification
- •6.3 Making Dimensional Measurements With the SEM: How Big Is That Feature?
- •Using a Calibrated Structure in ImageJ-Fiji
- •6.4 Image Defects
- •6.4.1 Projection Distortion (Foreshortening)
- •6.4.2 Image Defocusing (Blurring)
- •6.5 Making Measurements on Surfaces With Arbitrary Topography: Stereomicroscopy
- •6.5.1 Qualitative Stereomicroscopy
- •Fixed beam, Specimen Position Altered
- •Fixed Specimen, Beam Incidence Angle Changed
- •6.5.2 Quantitative Stereomicroscopy
- •Measuring a Simple Vertical Displacement
- •References
- •7: SEM Image Interpretation
- •7.1 Information in SEM Images
- •7.2.2 Calculating Atomic Number Contrast
- •Establishing a Robust Light-Optical Analogy
- •Getting It Wrong: Breaking the Light-Optical Analogy of the Everhart–Thornley (Positive Bias) Detector
- •Deconstructing the SEM/E–T Image of Topography
- •SUM Mode (A + B)
- •DIFFERENCE Mode (A−B)
- •References
- •References
- •9: Image Defects
- •9.1 Charging
- •9.1.1 What Is Specimen Charging?
- •9.1.3 Techniques to Control Charging Artifacts (High Vacuum Instruments)
- •Observing Uncoated Specimens
- •Coating an Insulating Specimen for Charge Dissipation
- •Choosing the Coating for Imaging Morphology
- •9.2 Radiation Damage
- •9.3 Contamination
- •References
- •10: High Resolution Imaging
- •10.2 Instrumentation Considerations
- •10.4.1 SE Range Effects Produce Bright Edges (Isolated Edges)
- •10.4.4 Too Much of a Good Thing: The Bright Edge Effect Hinders Locating the True Position of an Edge for Critical Dimension Metrology
- •10.5.1 Beam Energy Strategies
- •Low Beam Energy Strategy
- •High Beam Energy Strategy
- •Making More SE1: Apply a Thin High-δ Metal Coating
- •Making Fewer BSEs, SE2, and SE3 by Eliminating Bulk Scattering From the Substrate
- •10.6 Factors That Hinder Achieving High Resolution
- •10.6.2 Pathological Specimen Behavior
- •Contamination
- •Instabilities
- •References
- •11: Low Beam Energy SEM
- •11.3 Selecting the Beam Energy to Control the Spatial Sampling of Imaging Signals
- •11.3.1 Low Beam Energy for High Lateral Resolution SEM
- •11.3.2 Low Beam Energy for High Depth Resolution SEM
- •11.3.3 Extremely Low Beam Energy Imaging
- •References
- •12.1.1 Stable Electron Source Operation
- •12.1.2 Maintaining Beam Integrity
- •12.1.4 Minimizing Contamination
- •12.3.1 Control of Specimen Charging
- •12.5 VPSEM Image Resolution
- •References
- •13: ImageJ and Fiji
- •13.1 The ImageJ Universe
- •13.2 Fiji
- •13.3 Plugins
- •13.4 Where to Learn More
- •References
- •14: SEM Imaging Checklist
- •14.1.1 Conducting or Semiconducting Specimens
- •14.1.2 Insulating Specimens
- •14.2 Electron Signals Available
- •14.2.1 Beam Electron Range
- •14.2.2 Backscattered Electrons
- •14.2.3 Secondary Electrons
- •14.3 Selecting the Electron Detector
- •14.3.2 Backscattered Electron Detectors
- •14.3.3 “Through-the-Lens” Detectors
- •14.4 Selecting the Beam Energy for SEM Imaging
- •14.4.4 High Resolution SEM Imaging
- •Strategy 1
- •Strategy 2
- •14.5 Selecting the Beam Current
- •14.5.1 High Resolution Imaging
- •14.5.2 Low Contrast Features Require High Beam Current and/or Long Frame Time to Establish Visibility
- •14.6 Image Presentation
- •14.6.1 “Live” Display Adjustments
- •14.6.2 Post-Collection Processing
- •14.7 Image Interpretation
- •14.7.1 Observer’s Point of View
- •14.7.3 Contrast Encoding
- •14.8.1 VPSEM Advantages
- •14.8.2 VPSEM Disadvantages
- •15: SEM Case Studies
- •15.1 Case Study: How High Is That Feature Relative to Another?
- •15.2 Revealing Shallow Surface Relief
- •16.1.2 Minor Artifacts: The Si-Escape Peak
- •16.1.3 Minor Artifacts: Coincidence Peaks
- •16.1.4 Minor Artifacts: Si Absorption Edge and Si Internal Fluorescence Peak
- •16.2 “Best Practices” for Electron-Excited EDS Operation
- •16.2.1 Operation of the EDS System
- •Choosing the EDS Time Constant (Resolution and Throughput)
- •Choosing the Solid Angle of the EDS
- •Selecting a Beam Current for an Acceptable Level of System Dead-Time
- •16.3.1 Detector Geometry
- •16.3.2 Process Time
- •16.3.3 Optimal Working Distance
- •16.3.4 Detector Orientation
- •16.3.5 Count Rate Linearity
- •16.3.6 Energy Calibration Linearity
- •16.3.7 Other Items
- •16.3.8 Setting Up a Quality Control Program
- •Using the QC Tools Within DTSA-II
- •Creating a QC Project
- •Linearity of Output Count Rate with Live-Time Dose
- •Resolution and Peak Position Stability with Count Rate
- •Solid Angle for Low X-ray Flux
- •Maximizing Throughput at Moderate Resolution
- •References
- •17: DTSA-II EDS Software
- •17.1 Getting Started With NIST DTSA-II
- •17.1.1 Motivation
- •17.1.2 Platform
- •17.1.3 Overview
- •17.1.4 Design
- •Simulation
- •Quantification
- •Experiment Design
- •Modeled Detectors (. Fig. 17.1)
- •Window Type (. Fig. 17.2)
- •The Optimal Working Distance (. Figs. 17.3 and 17.4)
- •Elevation Angle
- •Sample-to-Detector Distance
- •Detector Area
- •Crystal Thickness
- •Number of Channels, Energy Scale, and Zero Offset
- •Resolution at Mn Kα (Approximate)
- •Azimuthal Angle
- •Gold Layer, Aluminum Layer, Nickel Layer
- •Dead Layer
- •Zero Strobe Discriminator (. Figs. 17.7 and 17.8)
- •Material Editor Dialog (. Figs. 17.9, 17.10, 17.11, 17.12, 17.13, and 17.14)
- •17.2.1 Introduction
- •17.2.2 Monte Carlo Simulation
- •17.2.4 Optional Tables
- •References
- •18: Qualitative Elemental Analysis by Energy Dispersive X-Ray Spectrometry
- •18.1 Quality Assurance Issues for Qualitative Analysis: EDS Calibration
- •18.2 Principles of Qualitative EDS Analysis
- •Exciting Characteristic X-Rays
- •Fluorescence Yield
- •X-ray Absorption
- •Si Escape Peak
- •Coincidence Peaks
- •18.3 Performing Manual Qualitative Analysis
- •Beam Energy
- •Choosing the EDS Resolution (Detector Time Constant)
- •Obtaining Adequate Counts
- •18.4.1 Employ the Available Software Tools
- •18.4.3 Lower Photon Energy Region
- •18.4.5 Checking Your Work
- •18.5 A Worked Example of Manual Peak Identification
- •References
- •19.1 What Is a k-ratio?
- •19.3 Sets of k-ratios
- •19.5 The Analytical Total
- •19.6 Normalization
- •19.7.1 Oxygen by Assumed Stoichiometry
- •19.7.3 Element by Difference
- •19.8 Ways of Reporting Composition
- •19.8.1 Mass Fraction
- •19.8.2 Atomic Fraction
- •19.8.3 Stoichiometry
- •19.8.4 Oxide Fractions
- •Example Calculations
- •19.9 The Accuracy of Quantitative Electron-Excited X-ray Microanalysis
- •19.9.1 Standards-Based k-ratio Protocol
- •19.9.2 “Standardless Analysis”
- •19.10 Appendix
- •19.10.1 The Need for Matrix Corrections To Achieve Quantitative Analysis
- •19.10.2 The Physical Origin of Matrix Effects
- •19.10.3 ZAF Factors in Microanalysis
- •X-ray Generation With Depth, φ(ρz)
- •X-ray Absorption Effect, A
- •X-ray Fluorescence, F
- •References
- •20.2 Instrumentation Requirements
- •20.2.1 Choosing the EDS Parameters
- •EDS Spectrum Channel Energy Width and Spectrum Energy Span
- •EDS Time Constant (Resolution and Throughput)
- •EDS Calibration
- •EDS Solid Angle
- •20.2.2 Choosing the Beam Energy, E0
- •20.2.3 Measuring the Beam Current
- •20.2.4 Choosing the Beam Current
- •Optimizing Analysis Strategy
- •20.3.4 Ba-Ti Interference in BaTiSi3O9
- •20.4 The Need for an Iterative Qualitative and Quantitative Analysis Strategy
- •20.4.2 Analysis of a Stainless Steel
- •20.5 Is the Specimen Homogeneous?
- •20.6 Beam-Sensitive Specimens
- •20.6.1 Alkali Element Migration
- •20.6.2 Materials Subject to Mass Loss During Electron Bombardment—the Marshall-Hall Method
- •Thin Section Analysis
- •Bulk Biological and Organic Specimens
- •References
- •21: Trace Analysis by SEM/EDS
- •21.1 Limits of Detection for SEM/EDS Microanalysis
- •21.2.1 Estimating CDL from a Trace or Minor Constituent from Measuring a Known Standard
- •21.2.2 Estimating CDL After Determination of a Minor or Trace Constituent with Severe Peak Interference from a Major Constituent
- •21.3 Measurements of Trace Constituents by Electron-Excited Energy Dispersive X-ray Spectrometry
- •The Inevitable Physics of Remote Excitation Within the Specimen: Secondary Fluorescence Beyond the Electron Interaction Volume
- •Simulation of Long-Range Secondary X-ray Fluorescence
- •NIST DTSA II Simulation: Vertical Interface Between Two Regions of Different Composition in a Flat Bulk Target
- •NIST DTSA II Simulation: Cubic Particle Embedded in a Bulk Matrix
- •21.5 Summary
- •References
- •22.1.2 Low Beam Energy Analysis Range
- •22.2 Advantage of Low Beam Energy X-Ray Microanalysis
- •22.2.1 Improved Spatial Resolution
- •22.3 Challenges and Limitations of Low Beam Energy X-Ray Microanalysis
- •22.3.1 Reduced Access to Elements
- •22.3.3 At Low Beam Energy, Almost Everything Is Found To Be Layered
- •Analysis of Surface Contamination
- •References
- •23: Analysis of Specimens with Special Geometry: Irregular Bulk Objects and Particles
- •23.2.1 No Chemical Etching
- •23.3 Consequences of Attempting Analysis of Bulk Materials With Rough Surfaces
- •23.4.1 The Raw Analytical Total
- •23.4.2 The Shape of the EDS Spectrum
- •23.5 Best Practices for Analysis of Rough Bulk Samples
- •23.6 Particle Analysis
- •Particle Sample Preparation: Bulk Substrate
- •The Importance of Beam Placement
- •Overscanning
- •“Particle Mass Effect”
- •“Particle Absorption Effect”
- •The Analytical Total Reveals the Impact of Particle Effects
- •Does Overscanning Help?
- •23.6.6 Peak-to-Background (P/B) Method
- •Specimen Geometry Severely Affects the k-ratio, but Not the P/B
- •Using the P/B Correspondence
- •23.7 Summary
- •References
- •24: Compositional Mapping
- •24.2 X-Ray Spectrum Imaging
- •24.2.1 Utilizing XSI Datacubes
- •24.2.2 Derived Spectra
- •SUM Spectrum
- •MAXIMUM PIXEL Spectrum
- •24.3 Quantitative Compositional Mapping
- •24.4 Strategy for XSI Elemental Mapping Data Collection
- •24.4.1 Choosing the EDS Dead-Time
- •24.4.2 Choosing the Pixel Density
- •24.4.3 Choosing the Pixel Dwell Time
- •“Flash Mapping”
- •High Count Mapping
- •References
- •25.1 Gas Scattering Effects in the VPSEM
- •25.1.1 Why Doesn’t the EDS Collimator Exclude the Remote Skirt X-Rays?
- •25.2 What Can Be Done To Minimize gas Scattering in VPSEM?
- •25.2.2 Favorable Sample Characteristics
- •Particle Analysis
- •25.2.3 Unfavorable Sample Characteristics
- •References
- •26.1 Instrumentation
- •26.1.2 EDS Detector
- •26.1.3 Probe Current Measurement Device
- •Direct Measurement: Using a Faraday Cup and Picoammeter
- •A Faraday Cup
- •Electrically Isolated Stage
- •Indirect Measurement: Using a Calibration Spectrum
- •26.1.4 Conductive Coating
- •26.2 Sample Preparation
- •26.2.1 Standard Materials
- •26.2.2 Peak Reference Materials
- •26.3 Initial Set-Up
- •26.3.1 Calibrating the EDS Detector
- •Selecting a Pulse Process Time Constant
- •Energy Calibration
- •Quality Control
- •Sample Orientation
- •Detector Position
- •Probe Current
- •26.4 Collecting Data
- •26.4.1 Exploratory Spectrum
- •26.4.2 Experiment Optimization
- •26.4.3 Selecting Standards
- •26.4.4 Reference Spectra
- •26.4.5 Collecting Standards
- •26.4.6 Collecting Peak-Fitting References
- •26.5 Data Analysis
- •26.5.2 Quantification
- •26.6 Quality Check
- •Reference
- •27.2 Case Study: Aluminum Wire Failures in Residential Wiring
- •References
- •28: Cathodoluminescence
- •28.1 Origin
- •28.2 Measuring Cathodoluminescence
- •28.3 Applications of CL
- •28.3.1 Geology
- •Carbonado Diamond
- •Ancient Impact Zircons
- •28.3.2 Materials Science
- •Semiconductors
- •Lead-Acid Battery Plate Reactions
- •28.3.3 Organic Compounds
- •References
- •29.1.1 Single Crystals
- •29.1.2 Polycrystalline Materials
- •29.1.3 Conditions for Detecting Electron Channeling Contrast
- •Specimen Preparation
- •Instrument Conditions
- •29.2.1 Origin of EBSD Patterns
- •29.2.2 Cameras for EBSD Pattern Detection
- •29.2.3 EBSD Spatial Resolution
- •29.2.5 Steps in Typical EBSD Measurements
- •Sample Preparation for EBSD
- •Align Sample in the SEM
- •Check for EBSD Patterns
- •Adjust SEM and Select EBSD Map Parameters
- •Run the Automated Map
- •29.2.6 Display of the Acquired Data
- •29.2.7 Other Map Components
- •29.2.10 Application Example
- •Application of EBSD To Understand Meteorite Formation
- •29.2.11 Summary
- •Specimen Considerations
- •EBSD Detector
- •Selection of Candidate Crystallographic Phases
- •Microscope Operating Conditions and Pattern Optimization
- •Selection of EBSD Acquisition Parameters
- •Collect the Orientation Map
- •References
- •30.1 Introduction
- •30.2 Ion–Solid Interactions
- •30.3 Focused Ion Beam Systems
- •30.5 Preparation of Samples for SEM
- •30.5.1 Cross-Section Preparation
- •30.5.2 FIB Sample Preparation for 3D Techniques and Imaging
- •30.6 Summary
- •References
- •31: Ion Beam Microscopy
- •31.1 What Is So Useful About Ions?
- •31.2 Generating Ion Beams
- •31.3 Signal Generation in the HIM
- •31.5 Patterning with Ion Beams
- •31.7 Chemical Microanalysis with Ion Beams
- •References
- •Appendix
- •A Database of Electron–Solid Interactions
- •A Database of Electron–Solid Interactions
- •Introduction
- •Backscattered Electrons
- •Secondary Yields
- •Stopping Powers
- •X-ray Ionization Cross Sections
- •Conclusions
- •References
- •Index
- •Reference List
- •Index
181 |
12 |
12.5 · VPSEM Image Resolution
a |
b |
. Fig. 12.8 a High resolution SEM imaging of gold deposited on carbon in conventional SEM; E0 = 30 keV; E–T (positive bias) detector (bar = 200 nm) (image courtesy J. Mershon, TESCAN). b High resolution
SEM imaging of gold deposited on carbon in VPSEM; 300 Pa N2; E0 = 30 keV; BSE detector (bar = 200 nm) (Image courtesy J. Mershon, TESCAN)
12.5\ VPSEM Image Resolution
Remarkably, despite the strong gas scattering and the development of the skirt around the focused beam, the image resolution that can be achieved in VPSEM operation is very similar to that for the same specimen imaged at the same incident beam energy in a conventional high vacuum SEM. A comparison of high vacuum SEM and VPSEM imaging performance for gold islands on carbon using a modern thermal field emission gun SEM is shown in . Fig. 12.8, showing comparable spatial resolution, as originally demonstrated by Danilatos (1993). This extraordinary imaging performance in the VPSEM can be understood by recognizing that elastic scattering is a stochastic process. As beam electrons encounter the gas molecules and atoms in the elevated pressure region, elastic scattering events occur, but not every electron suffers elastic scattering immediately. There remains an unscattered fraction of electrons that follows the expected path defined by the objective lens field and lands in the focused beam footprint identical to the situation at high vacuum but with reduced intensity due to the gas scattering events that rob the beam of some of the electrons. As the gas scattering path, which is a product of working distance and the gas pressure, increases, the unscattered fraction of the beam decreases and eventually reaches zero intensity. The fraction of unscattered electrons that remain in the beam can be calculated by the Monte Carlo simulation in DTSA-II, and an example is plotted in . Fig. 12.9. For 20-keV electrons passing through 10 mm of water vapor at 200 Pa, approximately 20%
of the original beam current reaches the specimen surface unscattered and contained within the focused beam. The electrons that remain in the beam behave exactly as they would in a high vacuum SEM, creating the same interaction volume and generating secondary and backscattered electrons with exactly the same spatial distributions. The electrons that land in the scattering skirt also generate secondary and backscattered electrons in response to the local specimen characteristics they encounter, for example, surface inclination, roughness, composition, an so on, which may be different from the region sampled by the focused beam. Because these skirt electron interactions effectively arise from a broad, diffuse area rather than a focused beam, they cannot respond to fine-scale spatial details of the specimen as the beam is scanned. The skirt electrons interact over such a broad area that effectively they only contribute increased noise to the measurement, degrading the signal-to-noise ratio of the useful high resolution signal generated by the unscattered electrons that remain in the focused beam. This degraded signal-to-noise does degrade the visibility threshold, which can be compensated by increasing the beam current and/or by increasing the pixel dwell time. The degradation of feature visibility due to gas scattering has the most impact at the short pixel dwell times (high scan rates) that are typically selected for rapidly surveying a specimen to search for features of interest. The prudent VPSEM microscopist will always use long pixel dwell times to reduce the contrast visibility threshold to ensure that a low-contrast feature of interest can be observed.
182\ Chapter 12 · Variable Pressure Scanning Electron Microscopy (VPSEM)
. Fig. 12.9 Fraction of a 20-keV beam that remains unscattered after passage through 10 mm of water vapor at various pressures
Unscattered fraction remaining in beam
20 keV 10 mm path H2O 1.0
0.8
0.6
0.4
0.2
0.0
0 |
200 |
400 |
600 |
800 |
1000 |
Pressure (Pa)
12.6\ Detectors for Elevated Pressure 12 Microscopy
12.6.1\ Backscattered Electrons—Passive
Scintillator Detector
As noted above, the E–T detector, or any other detector which employs a high accelerating voltage post-specimen, such as the channel plate multiplier, cannot be used at elevated VPSEM pressures due to ionization of the gas atoms leading to large-scale electrical breakdown. The passive backscattered electron detectors, including the semiconductor and scintillator detectors, are suitable for elevated pressure, since the backscattered electrons suffer negligible energy loss while transiting the environmental gas and thus retain sufficient energy to activate the scintillator without post-specimen acceleration. In fact, an added advantage of elevated pressure VPSEM operation is that the gas discharging allows the bare scintillator to be used without the metallic coating required for conventional high vacuum operation. An example of a VPSEM image of polymer foam prepared with a large symmetric BSE detector placed symmetrically above the specimen is shown in . Fig. 12.10 (left).
. Figure 12.11a shows an example of a BSE image of polished Raney nickel alloy obtained with a passive scintillator detector in water vapor at a pressure of 500 Pa (3.8 torr) with a beam energy of 20 keV. This BSE image shows compositional contrast similar to that observed under high vacuum conventional SEM imaging.
12.6.2\ Secondary Electrons–Gas
Amplification Detector
To utilize the low energy secondary electrons in the VPSEM, a special elevated pressure SE detector that utilizes ionization of the environmental gas (gaseous secondary electron detector, GSED) has been developed (Danilatos 1990). As shown schematically in . Fig. 12.12, an electrode (which may also serve as the final pressure limiting aperture) in close proximity to the electrically grounded specimen is maintained at a modest accelerating voltage of a few hundred volts positive. The exact value of this applied voltage is selected so as not to exceed the breakdown voltage for the gas species and pressure being utilized. The SE emitted from the specimen are accelerated toward this electrode and undergo collisions with the gas molecules, ionizing them and creating positive ions and more free electrons. The mean free path for this process is a few tens of micrometers, depending on the gas pressure and the accelerating voltage, so that multiple generations of ionizing collisions can occur between SE emission from the specimen and collection at the positive electrode. Moreover, the electrons ejected from the gas atoms are also accelerated toward the wire and ionize other gas atoms, resulting in a cascade of increasing charge carriers, progressively amplifying the current collected at the electrode by a factor up to several hundred compared to the SE current originally emitted from the specimen. While BSE can also contribute to the total signal collected at the electrode by collisions with gas molecules,
183 |
12 |
12.6 · Detectors for Elevated Pressure Microscopy
. Fig. 12.10 Uncoated polymer foam imaged under VPSEM conditions at E0 = 20 keV: (left) large solid angle symmetric BSE detector placed above the specimen; (bar = 500 µm) (right) same area with induced field SE detector (bar = 500 µm) (Images courtesy J. Mershan, TESCAN)
BSE |
GSED |
a |
150 mm |
b |
150 mm |
|
|
. Fig. 12.11 VPSEM imaging of a polished Raney nickel alloy surface. a backscattered electron detector (BSE). b gaseous secondary electron detector (GSED). Note the details visible in the shrinkage cavity in the GSED image
the mean free path for gas collisions increases rapidly with increasing electron energy thus decreasing the frequency of gas ionizations by the BSE. The contribution of the high energy BSE to the current amplification cascade is much less than that of the SE. To make simultaneous use of both the BSE and SE signals, a detector array such as that shown in . Fig. 12.13 can be utilized, combining an annular scintillator BSE detector with the GSED. An example of the same area of the polished Raney nickel alloy simultaneously
obtained with the GSED is shown in . Fig. 12.11b, operating under VPSEM conditions with water vapor at a pressure of 600 Pa.
Other variants of the GSED have been developed that make use of other physical phenomena that occur in the complex charged particle environment around the beam impact on the specimen, including the magnetic field induced by the motion of the charged particles and the cathodoluminescence of certain environmental gases induced by the SE
\184 Chapter 12 · Variable Pressure Scanning Electron Microscopy (VPSEM)
Gaseous Secondary Electron Detector (GSED)
+ |
+ |
+ ions |
+ |
|
|
|
+ |
+V + 30 V to + 600 V
+ |
+ |
SE |
|
+ |
|||
|
|
+ |
. Fig. 12.12 Schematic diagram showing principle of operation of the gaseous secondary electron detector (GSED)
Light guide |
scin |
|
BSE
12
+ ions
GSED and BSE detector array
scin
SE |
BSE |
|
+V |
+ 30 to |
|
+ 600 V |
||
|
. Fig. 12.13 Co-mounted BSE and GSED detectors, showing positions relative to the electron beam
and BSE. An example of an induced-field SE detector image is shown in . Fig. 12.10 (right).
12.7\ Contrast inVPSEM
In general, the contrast mechanisms for the BSE and SE signals that are familiar from conventional high vacuum SEM operate in a similar fashion in VPSEM. For example, in the BSE detector image shown in . Fig. 12.11a, most of the region of the Raney nickel alloy being viewed consists of a flat polished surface. Close examination of this image reveals atomic
number (compositional) contrast from the flat surface that is consistent with what would be observed for this specimen with the BSE signal in a conventional high vacuum SEM operating at the same beam energy. This same atomic number contrast can be observed in the simultaneously recorded GSED SE image in . Fig. 12.11b. Atomic number contrast appears in the GSED SE image because of the atomic number dependence of the SE2 class of secondary electrons that are generated by the exiting BSEs and are thus subject to the same contrast mechanisms as the BSEs. This is again familiar contrast behavior equivalent to high vacuum SEM imaging experience with the E–T detector. An important difference in the VPSEM case is the loss of the large contribution to atomic number contrast made by the SE3 class in a high vacuum SEM. The SE3 contribution is not a significant factor in the VPSEM since the SE3 are generated on the chamber walls and objective lens outside of the accelerating field of the GSED and thus do not contribute to the SE signal.
Most BSE and SE images can be interpreted from the experience of high vacuum SEM, but as in all SEM image interpretation, the microscopist must always consider the apparent illumination situation provided by the detector in use. The GSED class of detectors is effectively located very close to the incident beam and thus provide apparent illumination along the line-of-sight. Moreover, the degree of amplification increases with distance of the surface from the GSED detector. These characteristics of the GSED lead to an important difference between . Fig. 12.11a, b. The deep cavity is much brighter in the GSED image compared to the BSE image. The cavity walls and floor are fully illuminated by the electron beam and fine scale features can be captured at the bottom, as shown in the progressive image sequence in
. Fig. 12.14. The differing contrast in these images is a result of the relative positions and signal responses of the BSE and GSED detectors. Both detectors are annular, but the GSED detector is effectively looking along the beam and produces apparent lighting along the viewer’s direction of sight. The annular BSE detector intercepts BSEs traveling at a minimum angle of approximately 20 degrees to the beam so that the effective lighting appears to come from outside the viewer’s direction of sight. The cavity appears dark in the BSE image because although the primary beam strikes the walls and floor, there is no line-of-sight from cavity surfaces to the BSE detector. The BSEs are strongly reabsorbed by the walls and/or scattered out of the line-of-sight collection of the BSE detector. Because the environmental gas penetrates into the holes, as long as the primary beam can strike a surface and cause it to emit secondary electrons, the positive collection potential on the final pressure limiting aperture will attract electrons from the ionization cascade and generate a measurable SE signal, as shown schematically in . Fig. 12.15 (Newbury 1996). Because of the added ionization path represented by the depth